San Diego-based Qualcomm has tied with an European nanoelectronics research institute, IMEC, the firm said today, to work on 3D integration of integrated circuits. According to the firm and the institute, Qualcomm will participate in a program focused on three-dimensional integration of wafer-level packaging and IC-stacking. 3D and IC stacking technology is a major focus of research for semiconductor manufacturers, looking to increase density of systems-on-a-chip. Qualcomm joins Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC as partners of IMEC.
Top NewsMonday, July 14, 2008
Qualcomm Ties With European Research Organization