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Semtech Taps IBM For New Chip Technology




Camarillo-based Semtech Corp., a manufacturer of analog and mixed signal semiconductors, said Wednesday that it has tapped IBM for a new, high performance ADC/DSP product. The firm said it is using IBM's 3d through-via (TSV) technology for the new chips, which have applications in fiber optic telecommunications, high performance RF sampling and filtering, test equipment and instrumentation, and sub-array processing for phased array radar systems.


 

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