Friday, February 3, 2017

Qualcomm Launches $3 Billion Joint Venture With TDK

San Diego-based Qualcomm and TDK Corporation announced Friday morning that they have launched a joint venture, RF360 Holdings Singapore PTE. Ltd., to provide RF front-end (RFFE) modules and RF filters for the mobile device, automotive, and Internet-of-Things (IoT) market. Qualcomm and TDK said the deal to create the new joint venture is worth approximately $3 billion dollars. RF360 Holdings will be a Singapore corporation, with headquarters in Munich, Germany, and R&D and manufacturing and/or sales locations in Europe and Asia. Qualcomm Global Trading PTE. Ltd, a subsidiary of Qualcomm, will own 51 percent of the new JV; 49 percent will be owned by EPCOS AG.

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