Monday, February 6, 2017

Western Digital Pushes 3D NAND Technology To 64 Layers

Irvine-based Western Digital said today that it has started pilot production on a 512 Gigabit (Gb), three-bits-per cell, 64-layer 3D NAND chip--a big push forward in 3D NAND technology. WD said it expects to put the chip into mass production in the second half of 2017. The chip is being manufactured in Yokkaichi, Japan.

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